品質政策

品質政策

本公司為追求產品穩定度及可靠度，以利提升客戶產品生產效率，降低客戶生產成本，從晶圓製造、晶片檢查、封裝測試、成品檢查、包裝儲存等均以嚴格檢測方式確保產品品質，並作以下各式品質測試標：

產品可靠度
1. High temp. operating life test (HTOLT) (125°C/6V/1000hrs) dynamic   stress.
2. High temp. bias life test (HTBLT) (125°C/6V/1000hrs) static stress
3. Low temp. operating life test (LTOLT) (-30°C/6V/1000hrs)

封裝可靠度
1. Pre-condition test (TCT/bake/seak/IR re-flow)
2. Pressure cooker test (PCT) (121°C/100%RH/168hrs)
3. Highly accelerated stress test (HAST) (130°C/85%RH/168hrs)
4. Temp. cycle test (TCT) (-65°C~150°C/1000cycles, 15min/cycle)
5. High temp. storage life test (150°C/1000hrs)

製程可靠度
1. ESD test (human body mode/machine mode) (2KV/200V)
2. Latch-up test (I>100mA)