Environment and Quality

Quality Policy

Raffar pursues quality and reliability for benefit customer production efficiency, lower customer production cost. Raffar do quality assurance for wafer chip probing, package function test, finish good inspection, and storage control as showed the reliability index below:

Product Reliability
1. High temp. operating life test (HTOLT) (125°C/6V/1000hrs) dynamic   stress.
2. High temp. bias life test (HTBLT) (125°C/6V/1000hrs) static stress
3. Low temp. operating life test (LTOLT) (-30°C/6V/1000hrs)

Package Reliability
1. Pre-condition test (TCT/bake/seak/IR re-flow)
2. Pressure cooker test (PCT) (121°C/100%RH/168hrs)
3. Highly accelerated stress test (HAST) (130°C/85%RH/168hrs)
4. Temp. cycle test (TCT) (-65°C~150°C/1000cycles, 15min/cycle)
5. High temp. storage life test (150°C/1000hrs)

Process Reliability
1. ESD test (human body mode/machine mode) (2KV/200V)
2. Latch-up test (I>100mA)